Measurement of Thermal Properties of Gypsum Board at Elevated Temperatures.
Measurement of Thermal Properties of Gypsum Board at
Elevated Temperatures.
(545 K)
Manzello, S. L.; Park, S. H.; Mizukami, T.; Bentz, D. P.
Session 5: Timber Structures;
Structures in Fire (SiF'08), 5th International
Conference. Proceedings. Session 5: Timber Structures.
May 28-30, 2008, Singapore, 656-665 pp, 2008.
Keywords:
gypsum board; thermal properties; temperature; thermal
conductivity; specific heat; mass loss; equations; wall
assemblies
Abstract:
The thermal conductivity, specific heat, mass loss, and
linear contraction for gypsum board types widely used in
the USA and Japan were measured both at room temperature
and elevated temperatures. The gypsum board types tested
include Type X and Type C from the USA and Type R and
Type F from Japan. Results indicate that the difference
in thermal properties of all gypsum board samples tested
in the present study is not significant, particularly at
elevated temperatures. A large difference in linear
contraction among gypsum board samples was observed at
elevated temperatures, implying a significant difference
in mechanical behavior at fire temperatures. The
experimental data set provides valuable information that
can be used to model the behavior of gypsum board at
elevated temperatures.
